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MTD20P06HDL
PACKAGE DIMENSIONS
DPAK
CASE 369C?01
ISSUE O
B
C
?T?
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
V
R
E
DIM
INCHES
MIN MAX
MILLIMETERS
MIN MAX
A
B
0.235 0.245
0.250 0.265
5.97 6.22
6.35 6.73
S
1
4
2
3
A
K
U
Z
C
D
E
F
G
H
J
0.086 0.094
0.027 0.035
0.018 0.023
0.037 0.045
0.180 BSC
0.034 0.040
0.018 0.023
2.19 2.38
0.69 0.88
0.46 0.58
0.94 1.14
4.58 BSC
0.87 1.01
0.46 0.58
K
0.102 0.114
2.60 2.89
F
L
D
2 PL
J
H
L
R
S
U
V
Z
0.090 BSC
0.180 0.215
0.025 0.040
0.020 ???
0.035 0.050
0.155 ???
2.29 BSC
4.57 5.45
0.63 1.01
0.51 ???
0.89 1.27
3.93 ???
G
0.13 (0.005)
M
T
STYLE 2:
PIN 1. GATE
2. DRAIN
3. SOURCE
4. DRAIN
SOLDERING FOOTPRINT*
6.20
0.244
2.58
0.101
3.0
0.118
5.80
0.228
1.6
0.063
6 .17 2
0.243
SCALE 3:1
mm
inches
*For additional information on our Pb?Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
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